United States Patent #5,667,132 – Method for Soldering-Bonding Contact Pad Arrays, undated
File — Box: 52, Folder: 54
Dates
- Creation: undated
Repository Details
Part of the Science History Institute Archives Repository
Contact:
315 Chestnut Street
Philadelphia PA 19106 United States
215.873.8265
215.873.5265 (Fax)
reference@sciencehistory.org
315 Chestnut Street
Philadelphia PA 19106 United States
215.873.8265
215.873.5265 (Fax)
reference@sciencehistory.org