Skip to main content

Silicon Test Chip for Testing Wedge Effect in Hybrid Bonding, undated

 File — Box: 65, Folder: 51

Dates

  • Creation: undated

General Note

Contains 2 black and white images and 7 color images.

Repository Details

Part of the Science History Institute Archives Repository

Contact:
315 Chestnut Street
Philadelphia PA 19106 United States
215.873.8265
215.873.5265 (Fax)